Micro-Fluidic Injection Molded Solder (IMS)

ABSTRACT

A portion of compliant material includes four walls defining a slot. The slot has a relatively large cross-section end in fluid communication with a solder reservoir, and also has a relatively small cross-section end opposed to the relatively large cross-section end. The slot has a generally elongate rectangular shape when viewed in plan, with a length perpendicular to a scan direction, a width, parallel to the scan direction, associated with the relatively large cross section end, and a width, parallel to the scan direction, associated with the relatively small cross section end. The slot is configured in the portion of compliant material such that the relatively small cross-section end of the slot normally remains substantially closed, but locally opens sufficiently to dispense solder from the reservoir when under fluid pressure and locally unsupported by a workpiece. Methods of operation and fabrication are also disclosed.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a divisional of U.S. patent application Ser. No.13/088,727, filed Apr. 18, 2011, which is a divisional of U.S. patentapplication Ser. No. 12/399,244 filed on Mar. 3, 2009 incorporated byreference herein.

FIELD OF THE INVENTION

The present invention generally relates to the electrical and electronicarts and, more particularly, to injection molded solder techniques.

BACKGROUND OF THE INVENTION

U.S. Pat. No. 5,244,143 of Ference et al. discloses an apparatus andmethod for injection molding solder and applications thereof. Anapparatus and method are described for injection molding solder moundsonto electronic devices. The apparatus has a reservoir for molten solderwhich is disposed over a cavity in an injection plate. The injectionplate is disposed over a mold having an array of cavities therein intowhich solder is injection molded. The mold is disposed over a workpiece,such as a semiconductor chip or a semiconductor chip packagingsubstrate. The cavities in the mold are aligned with electrical contactlocations on the chip or substrate. The workpiece is heated and themolten solder is forced under gas pressure into the cavity in theinjection plate disposed above the array of cavities in the mold. Themolten solder is forced into the array of cavities in the mold. Theinjection plate is advanced to slide over the mold to wipe away theexcess solder above the mold at a plurality of wiping apertures in theinjection plate. The injection plate is further advanced to a locationhaving a nonsolder wettable surface at which location the injectionplate is removed. The mold is then removed to leave solder moundsdisposed on the workpiece. The workpiece can be a semiconductor chip, asemiconductor chip packaging substrate or a dummy substrate onto whichthe injected molded solder adheres such as a polymer layer to form acarrier substrate for a solder mound array which can be subsequentlytransferred to a substrate such as a semiconductor chip or asemiconductor chip packaging substrate. The apparatus and methods of theinvention can be integrated into an automated manufacturing system fordepositing an array of solder mounds onto a substrate.

Thus, the forming of solder interconnects by injection molding thesolder in a mold or decal layer is becoming more established in theindustry.

SUMMARY OF THE INVENTION

Principles of the present invention provide techniques for micro-fluidicinjection molded solder (IMS).

An exemplary apparatus, according to an aspect of the invention,includes a solder reservoir and a portion of compliant material. Theportion includes four walls defining a slot, the slot having arelatively large cross-section end in fluid communication with thesolder reservoir, and also having a relatively small cross-section endopposed to the relatively large cross-section end. The slot has agenerally elongate rectangular shape when viewed in plan, with a lengthperpendicular to a scan direction, a width, parallel to the scandirection, associated with the relatively large cross section end, and awidth, parallel to the scan direction, associated with the relativelysmall cross section end. The slot is configured in the portion ofcompliant material such that the relatively small cross-section end ofthe slot normally remains substantially closed, but locally openssufficiently to dispense solder from the reservoir when under fluidpressure and locally unsupported by a workpiece.

In another aspect, the combination of an apparatus, as described, with asuitable workpiece having solder-receiving cavities, is contemplated.

In still another aspect, an exemplary method includes the steps ofproviding a workpiece having a plurality of solder-receiving cavitiesdefined therein; providing an apparatus of the kind described; andscanning the workpiece, relative to the slot in the portion of compliantmaterial, in the scan direction, with the small cross-section end of theslot in contact with the workpiece, and with the fluid pressure appliedat least when the slot is aligned with given ones of the cavities, tosequentially dispense solder from the reservoir into the given ones ofthe cavities.

In an even further aspect, a method of fabricating embodiments of theapparatus includes providing a sheet of elastomeric material; andcutting a first long incision along a surface of the material to form afirst straight wall making an angle, α, with horizontal, the first longincision describing a line along the surface of the sheet. Also includedis cutting a second long incision along a surface of the material toform a second straight wall making an angle, β, with horizontal, thesecond long incision beginning at the line along the surface of thesheet, such that a slot is formed. The slot has a relatively largecross-section end and a relatively small cross-section end opposed tothe relatively large cross-section end. A further step includes securingthe sheet to a solder reservoir such that the relatively largecross-section end is in fluid communication therewith.

These and other objects, features and advantages of the presentinvention will become apparent from the following detailed descriptionof illustrative embodiments thereof, which is to be read in connectionwith the accompanying drawings (note that section lining is generallyomitted from the drawings, except for solder-filled regions, in order toavoid clutter).

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a side view of an exemplary embodiment of a micro-fluidic (MF)IMS head, according to an aspect of the invention;

FIG. 2 is a bottom view of the solder head of FIG. 1;

FIG. 3 is a bottom view of the MF solder slot of the solder head of FIG.1, superimposed over mold cavities;

FIG. 4 is a side view of the MF solder slot of the solder head of FIG.1, between the cavities;

FIG. 5 is a side view of the MF solder slot of the solder head of FIG.1, over a cavity during fill;

FIG. 6 is a side view of the MF solder slot of the solder head of FIG.1, between vias of an organic substrate;

FIG. 7 is a side view of the MF solder slot of the solder head of FIG.1, over a via of the organic substrate during solder fill;

FIG. 8 shows the solder head of FIG. 1 in a lifted condition;

FIG. 9 shows a dross (solder oxide) particle lodged in the opening ofthe MF solder slot of the solder head of FIG. 1, and a stainless steelblade dislodging same; and

FIG. 10 shows a similar dross dislodging blade attached to an ultrasonictransducer to provide additional mechanical forces.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

One or more embodiments of the invention are of interest, for example,to integrated circuit solder interconnects, and more specifically theemerging field of injection molded solder processing for forming solderinterconnects. One or more embodiments of the invention provide amicrofluidic IMS structure and process, including a solder slot thatfunctions to dispense molten solder (fluid). Typically having a width inthe direction parallel to the scan from zero to only several microns,the inventive slot:

-   -   is capable of being lifted while the solder is molten without        any solder leakage    -   significantly reduces the build up of solder oxide, compared to        prior-art techniques, since there is very little molten solder        in contact with the ambient environment    -   provides optimal pressure (mechanical force per unit area) to        enhance wiping and sealing    -   provides optimized cavity fill properties without the need &        complexities of solidification.

FIG. 1 shows exemplary MF IMS head 100 with a microfluidic (MF) solderslot. As seen at location 108, the head 100 has a “V” shape from top tobottom cut into a compliant material 106. This material functions bothas a solder seal as well as a micro valve. When the solder reservoir 102is NOT pressurized, the V-shaped MF slot is completely closed, thuspreventing solder from leaking out, even if the head 100 is lifted. Ineffect, the bottom width of the MF slot is essentially zero. To cut thisslot, mechanical or other techniques are employed to cut an initialangle into the compliant material 106; then, the slot just formed isalso used as the starting point to cut a second angle, from the bottomside, thus forming the V shape. Since the slot 108 at the bottom face ofthe compliant material 106 is essentially closed, there is little to nosolder in contact with the ambient environment, thus significantlyreducing solder oxide (dross) formation. Note low friction elastomericregions 104 at the leading and trailing edges.

In typical embodiments, materials 104 and 106 are the same, except thatmaterial 106 has the slot 108 cut therein.

Note that exemplary head 100 includes foot 101, which mounts material106 and regions 104. Head 100 also includes connecting channel 103 whichconnects solder reservoir 102 to V-shaped MF slot 108.

As shown in FIG. 2, there is only a relatively small amount of compliantmaterial 106 on the bottom of the head 100. Thus, at a given absolutejoining force, the pressure (force per unit area) on the compliantmaterial 106 is much higher than if the entire bottom surface of thehead were covered by the material 106. This provides good wipingcharacteristics as well as allowing the compliant material 106 to bettertrack significant surface topography of the decals or molds that itscans over. This is especially required for bumping laminate or organicsubstrates that have substantially greater surface topography thanpolished glass molds. Finally, since the compliant material 106 thatcontains the MF V slot 108 is relatively narrow, the amount of materialin contact with the molten solder as the trailing edge wipes over filledcavities is also reduced, which improves fill quality. As seen in thebottom view in FIG. 2, low friction elastomeric regions 104 arepreferably in the form of four distinct “corner caps” located in thecorners, to provide stability for the head 100. Caps 104 may be formed,for example, from the same material as region 106, as will be discussedfurther below.

In many instances, the workpiece (for example, mold plate or substratewith mask, as discussed below) is at a lower temperature than themelting temperature of the solder. Accordingly, some embodiments includea heater element 9000 disposed adjacent the relatively largecross-section end of the slot 108. Heater element 9000 heats the solderto prevent premature solidification of the solder. Heater element 9000is preferably located as close to the solder injection point aspossible. As seen in FIGS. 1 and 2, in non-limiting exemplaryembodiments, connecting channel 103 is “jogged” as needed to provideroom for the element 9000. Given the teachings herein, the skilledartisan will be able to size the heater element (physical dimensions andwattage) depending on the temperature of the workpiece, ambienttemperature, melting point of the solder, materials of construction, andthe like, using thermal analysis tools such as, for example, ANSYS®software available from ANSYS, Inc., Canonsburg, Pa. 15317, USA.

FIG. 3 shows a magnified bottom view of the MF V slot 108 superimposedover a mold plate 350 with cavities (plate 350 may be, for example,glass). With a downward force over the compliant material 106 thatcontains the MF V slot 108, a selective opening of the V slot occurs asshown (material 106 is not shown per se in FIG. 3). In particular, themold plate moves (scans) relative to the slot in the direction shown,such that cavities 302 have already been filled, cavities 306 are empty,and cavities 304 are in the process of being filled. Slot 108 remainsgenerally closed, or only slightly open, away from cavities 304, but asseen in regions 310, opens up (for example, a few microns) over cavities304. The selective opening of the V-slot 108 is due to two factors: 1)the cavity opening below the slot, and 2) the positive reservoirpressure. The MF V slot 108 opens more over the unsupported cavity space310 than it does over the supported space between the cavities. Thus,the slot opens preferentially over cavities, such that the cavities canbe filled under positive reservoir pressure. In one or more embodiments,this pressure needs to be greater than for the much wider (that is,wider in the direction parallel to the scan), always-open solder slotsof the prior art. Thus, the pressure forces the MF V slot 108 open, inconjunction with the cavity 304. Once the pressure is off, the slotquickly closes again.

As seen in FIG. 4, which is a magnified side view of the MF V slot 108,in the areas between mold or decal cavities 452, the slot is essentiallyclosed. Thus, there is little to no solder in contact with the ambientenvironment, reducing or even minimizing oxidation.

FIG. 5 shows the MF V slot 108 in a magnified side view disposed over acavity 452 in the mold plate 350. At this point, the combination ofreservoir pressure plus an unsupported or unconstrained compliantcoating 106 opens the MF V slot 108, allowing it to dispense moltensolder into the cavity 452. Since the MF V solder slot 108 is preferablythe same width, or even narrower, than the cavity 452, it results inenhanced, and preferably optimal, fill quality. The reason for this isthat the solder exits the MF V slot 108 under relatively high pressure,and is thus able to completely push any residual ambient gas out of thecavity 452, as it enters from one side. This produces consistent edge toedge fill of the cavities 452, with similar fill quality to that seen inthe more complex IMS fill technology called “solidification,” known tothe skilled artisan from US Patent Publication No, 2005-0263571A1entitled “Injection molded continuously solidified solder method andapparatus.”

FIG. 6 shows another magnified side view of a MF V slot 108, this timepositioned over an organic substrate 662 having an aligned mask or decal660 disposed over it (for example, a polyimide film or a thin materialthat does not react with solder (e.g., non-wetting metals such asmolybdenum, stainless steel, aluminum, and the like)). Here again the MFV slot is closed since it is constrained while positioned over the spacebetween decal and via openings, 670, 668 respectively, in the organicsubstrate 662. Note also wetting surface 664 (for example, copper, gold,nickel, and the like).

Non-limiting examples of organic substrates include laminate materialsmade of glass fibers in an epoxy; for example, FR-4 (flame retardanttype 4) and BT-resin (Bismaleimide Triazine resin). Furthermore, itshould be noted that the invention is not limited to organic substrates;element 662 is also representative of a ceramic substrate or a siliconwafer, as aspects of the invention can also be employed to dispensesolder on ceramic substrates or silicon wafers. Thus, the wettable pads664 depicted in the figures also encompass ball-limiting metallurgy, inthe case of a silicon substrate (although wetting pads on silicon wouldtypically not be recessed in a deep via).

FIG. 7 shows a magnified side view of the MF V slot 108, now positionedover the opening in decal 660 and the via opening 668, causing the slot108 to dispense solder in a manner similar to FIG. 5.

FIG. 8 is a broader side view showing the main components of themicro-fluidic IMS head. Included are the solder reservoir 102 containingmolten alloy, either pressurized or not, the compliant material 106containing the MF V slot 108, and the MF V slot 108 itself which, evenwith the head lifted away from either a glass mold plate or an organiclaminate substrate, prevents the molten alloy in reservoir 102 fromleaking due to its “closed” configuration. When the head is lifted whilethe alloy is molten, the reservoir is NOT pressurized, to avoid leakage.

FIG. 9 shows the first of two exemplary approaches to remove possibledross particles 980 that may block part of the MF V slot 108. Theexample in FIG. 9 employs a thin stainless steel blade 984 that ismomentarily pushed through the MF V slot 108 while it is positioned overa “cleaning” trench 982 which traps the dross 980 thus removed. Thetrench preferably extends into and out of the plane of the illustrationwith a dimension sufficient to accommodate the blade (that is, it is nota series of holes where the blade would hit the regions between theholes, but rather a continuous trench). In addition to stainless steel,other materials non-wettable by solder, such as molybdenum or anodizedaluminum, can be used.

Finally, FIG. 10 shows a second dross cleaning approach. In thisembodiment, the thin stainless steel blade 984 is connected to anultrasonic transducer 1090 to enhance the ability to dislodge and removedross particles 980 that may block some of the MF V slot geometry 108.Transducer 1090 may induce, for example, low amplitude, high-frequencymotion of blade 984 in one, two, or three Cartesian dimensions.

Thus, aspects of the invention provide a Micro-Fluidic Injection MoldedSolder Structure and Process that use an inventive IMS head with asolder slot structure that dispenses molten solder by a microfluidicvalving process. One or more embodiments provide one or more advantagesfor many applications, such as solder bumping organic substrates thathave significant surface topography. In addition, one or moreembodiments provide hot-lift capability, reduced oxide formation, and/orenhanced (or even optimized) fill quality for cavities or vias that arefilled with molten solder. In one or more embodiments, the opening ofslot 108 (when positioned over a cavity and under pressure, as inregions 310) is a few microns; for example, from about 2 microns toabout 10 microns. The rather small slot opening typically results inlaminar flow of the solder. With reference to FIG. 4, angles alpha andbeta may each range from about 30 degrees to about 70 degrees, with amore preferred range of about 45 degrees to about 60 degrees. Further,in at least some preferred cases, alpha and beta are not equal; forexample, alpha could be about 30 to about 70 degrees, or more preferablyabout 45 to about 60 degrees, and most preferably about 45 degrees; andbeta could be approximately straight (that is, about 90 degrees). It hasbeen found that such an approach may lead to ease in fabrication andfixturing. In particular, a blade may be inserted to form anapproximately 45 degree cut for angle alpha, and the blade may again beinserted at the same point (apex of the “V”) to make a straight cut(beta=90 degrees). In such a case, the “V” is of course not symmetricalabout a vertical axis.

The long dimension of slot 108 can be, for example, about 1 inch (2.54cm) to about 1.5 inches (3.81 cm); however, where appropriate (such asfor wafer bumping), the length could be over 8 inches (20.32 cm), oreven up to about 12 inches (30.48 cm) or longer.

Note that there is relative motion between the solder head 100 and thecavities, such as 452, which will receive the molten solder. In somecases, the solder head is stationary; while in other embodiments, thesolder head may move while the other components are stationary.

In a non-limiting example, the hydrostatic pressure of the solder (whenit is desired to open the slot 108) is about 5 to about 20 pounds persquare inch gauge (PSIG) with a preferred value of about 12 PSIG (about34.5 to about 138 kilo-Pascals with a preferred value of about 82.7kilo-Pascals)(“gauge” refers to the amount above ambient atmosphericpressure; the amounts in kilo-Pascals are also given above ambientatmospheric pressure). Furthermore, in a non-limiting example, themechanical pressure between the head 100 and workpiece (that is, mold350 or decal 660) is about 15 to about 20 PSI (about 103 to about 138kilo-Pascals); these values are exemplary and non-limiting (in thegeneral case, it is desirable to avoid the hydrostatic pressure from“lifting” the head and yet also avoid having so much mechanical contactforce that the slot significantly distorts).

Recalling FIG. 1, note that fill head 100, which may be, for example,glass or metal, is provided with compliant material 106, which spreadsout (distributes uniformly, or nearly so) the compressive force between(i) head 100 and (ii) mold 350 or decal 660 on substrate 662, as thecase may be, resulting in good contact.

Compliant material 106 may include, for example, a bulk compressiblelayer with a thin low-friction layer adjacent mold 350 or decal 660 onsubstrate 662, as the case may be. Non-limiting examples of compliantmaterials for the bulk compressible layer are (i) low durometer puresilicone rubber and (ii) silicone closed cell sponge. Non-limitingexamples of materials for the low-friction layer are fluoropolymers suchas Teflon®(registered mark of E. I. Du Pont De Nemours And Company,Wilmington, Del., USA), fiberglass reinforced Tetlon® material, andRulon® TFE Fluorocarbon (registered mark of Saint-Gobain PerformancePlastics Corporation, Aurora, Ohio USA). The low-friction layer may be,for example, just thick enough to resist abrasion (for example, about0.010 inches or about 0.254 mm). The total thickness of the low frictionlayer plus the bulk compressible layer may be, for example, from about1/32 inch to about ¼ inch, with a preferred thickness of about 1/16 inch(from about 0.79 mm to about 6.35 mm, with a preferred thickness ofabout 1.59 mm).

Note that a V-shape is preferred for slot 108; however, any shape whereincreased pressure causes a normally closed slot to open slightly can beused; for example, the walls of the “V,” instead of being straight,could be curved to some extent. Further, the slot should have a narrow,normally-closed portion against the decal or mold, with a wider portionthat interfaces with the connecting channel 103.

In view of the discussion thus far, it will be appreciated that, ingeneral terms, an exemplary apparatus, according to an aspect of theinvention, can include a solder reservoir 102 and a portion of compliantmaterial 106. The portion 106 can include four walls defining a slot108. The slot has a relatively large cross-section end in fluidcommunication with the solder reservoir 102, and a relatively smallcross-section end opposed to the relatively large cross-section end. Asbest seen in FIG. 2, the slot has a generally elongate rectangular shapewhen viewed in plan (that is, top or bottom view perpendicular to theplane of the slot). As best seen in FIGS. 2-4, slot 108 has a length, L,perpendicular to the scan direction, a width, W₁, parallel to the scandirection, associated with the relatively large cross section end, and awidth, W₂, parallel to the scan direction, associated with therelatively small cross section end. W₂ may be zero when the slot isclosed; this condition is shown in the main part of FIG. 4 while aslight opening is shown in the inset. The slot 108 is configured in theportion of compliant material 106 such that the relatively smallcross-section end of the slot normally remains substantially closed, butlocally opens sufficiently to dispense solder from the reservoir 102when under fluid pressure and locally unsupported by a workpiece (as inregions 310). As used herein, including the claims, “substantiallyclosed” means completely closed, such that the sides are in contact, oronly very slightly open (roughly, less than about 2 microns), such thatweeping out of solder does not occur, or occurs to such a slight amountthat mold filling is not interfered with.

As best seen in FIG. 4, in one or more embodiments, the four wallsinclude a first straight wall 493 running along the length perpendicularto the scan direction, the first straight wall making an angle, α, withhorizontal, and a second straight wall running along the lengthperpendicular to the scan direction, the second straight wall 491 makingan angle, β, with horizontal, the first and second straight wallsmeeting at the relatively small cross-section end. It should be notedthat, as used herein, including the claims, “four walls” may include,for example, the aforementioned walls 491 and 493, with the ends of theslot formed by any kind of walls, for example, curved, straight, and soon.

As discussed above, in some cases, α=β, such that the slot issymmetrically V-shaped when viewed in cross-section along the lengthperpendicular to the scan direction.

In some instances, the relatively small cross-section end of the slot(that is, where the leader from reference character 108 points in FIG.4), when locally open under the fluid pressure (as at regions 310 inFIG. 3), has a width parallel to the scan direction of from about 2microns to about 10 microns. Furthermore, the portion of compliantmaterial 106 can be configured such that the local opening under thefluid pressure occurs when the fluid pressure is from about 5 to about20 PSIG, and most preferably about 12 PSIG. Fluid pressure can beprovided by a source of fluid pressure 195 as seen in FIG. 1; forexample, a compressor or flask may be provided to provide anoverpressure with N₂ or another inert gas.

In one or more embodiments, the long dimension L of the slot, as bestseen in FIG. 2, can be about 1 inch to about 12 inches; that is, thefirst and second straight walls 493, 491 have a length of from about 1inch to about 12 inches.

In at least some instances, an actuator 197, as seen in FIG. 1, isconfigured to urge the portion of compliant material 106 against anexternal workpiece (for example, mold 350 or decal/substrate combination660, 662) with a mechanical contact pressure of from about 15 PSI toabout 20 PSI. This mechanical contact pressure is defined as the forcedivided by the total area of region 106 and the four corner caps 104.

In one or more embodiments, the apparatus also includes a dross-removingknife 984 disposed for vertical motion in the slot 108; optionally, withan ultrasonic actuator 1090 coupled to the knife.

In a preferred but non-limiting embodiment, a foot 101 is also included.The portion of compliant material 106 is mounted to the foot 101, andthe solder reservoir 102 is secured to the foot 101. Fluid communicationmay in any case be provided, for example, by connecting channel 103. Asseen in FIG. 2, the foot 101 is generally rectangular when viewed inplan and has a bottom surface 199. Elastomeric corner caps 104 aresecured to the bottom surface 199 of the foot 101.

As best seen in FIG. 4, the portion of compliant material 106 caninclude, for example, a bulk compressible layer 495 and an attachedlow-friction layer 497 adapted to be positioned against a workpiece,such as mold 350 or decal 660 with substrate 662.

The portion of compliant material 106 can have a total thickness of fromabout 1/32 inch to about ¼ inch. The bulk compressible layer 495 can be,for example, low durometer pure silicone rubber or silicone closed cellsponge, and the low-friction layer 497 can be a fluoropolymer (which mayor may not be reinforced with fiberglass or the like).

In another aspect, an exemplary method includes the step of providing aworkpiece having a plurality of solder-receiving cavities definedtherein. The workpiece can be, for example, mold plate 350 with cavities452 or a substrate assembly formed from substrate 662 withsolder-receiving cavities 668 and mask structure 660 disposed over thesubstrate. The mask structure has a plurality of solder through-holes670 aligned with the solder-receiving cavities 668 in the substrate.Additional steps include providing an apparatus such as apparatus 100,and scanning the workpiece, relative to the slot 108 in the portion ofcompliant material 106, in the scan direction, with the smallcross-section end of the slot in contact with the workpiece, and withthe fluid pressure applied at least when the slot is aligned with givenones of the cavities, to sequentially dispense solder from the reservoir102 into the given ones of the cavities. In at least some instances, themethod also includes removing the fluid pressure, and, subsequent to theremoving step, lifting the compliant material 106 from the workpiece.

Aspects of the invention further contemplate the combination of aworkpiece having a plurality of solder-receiving cavities definedtherein; and an apparatus 100 of the kind described. A variety ofdifferent types of workpieces are possible. One type of workpiece is amold plate 350 with cavities 452. Another type of workpiece is asubstrate 662 as shown in FIG. 7, which in at least some cases could beused in a maskless fashion (i.e., head 106 dispenses solder from slot108 into regions 668 (an example of solder-receiving cavities) to adhereto recessed pad 664, without use of mask 660). Still another type ofworkpiece is a substrate assembly. Such an assembly includes a substrate662 and a mask structure 660. “Assembly” does not necessarily implyphysical fastening but also contemplates mere alignment. Through holesin the mask 660 are aligned with the pads 664. Recessed pads 664 withregions 668 are an example of solder-receiving cavities. As used in theclaims, to avoid confusion with the substrate used without a mask, thesubstrate 662 in this aspect is referred to as a “substrate assemblysubstrate” and the mask 660 is referred to as a “substrate assembly maskstructure.”

Still another example of a workpiece is a wafer assembly. Again,“assembly” does not necessarily imply physical fastening but alsocontemplates mere alignment. Such an assembly includes a wafer havingsolder-receiving regions and a wafer mask structure disposed over thewafer. This aspect can be visualized by considering FIG. 7 if the pads664 were not recessed, but rather even with the upper surface of element662, such that there were no regions 668. In this case, mask 660 wouldneed to be used. Mask 660 in this case could be referred to as a wafermask structure. The plurality of through-holes in the mask would bealigned with the solder-receiving regions (non-recessed pads) in thewafer to form the solder-receiving cavities.

In some instances, the apparatus includes dross-removing knife 984disposed for vertical motion in the slot 108, and the workpiece isformed with a dross-receiving trench 982 (that is, a trench, asdescribed above, formed in the workpiece that is separate and distinctfrom the cavities intended to receive solder for interconnect-formingpurposes).

In still a further aspect, an exemplary method includes the steps ofproviding a sheet of elastomeric material 106 and cutting a first longincision along a surface of the material to form a first straight wall493 making an angle, α, with the horizontal. The first long incisiondescribes a line along the surface of the sheet 106. An additional stepincludes cutting a second long incision along a surface of the materialto form a second straight wall 491 making an angle, β, with horizontal.The second long incision begins at the line along the surface of thesheet, such that a slot is formed, with a relatively large cross-sectionend and a relatively small cross-section end opposed to the relativelylarge cross-section end. A further step includes securing the sheet to asolder reservoir 102 such that the relatively large cross-section end isin fluid communication therewith. Values of α and β can be as set forthabove.

Typical dimensions for cavities such as 452 can be, for example, 100micron diameter and 30 microns deep. Typical dimensions for openings 670and cavities 668 can be, for example, 100 microns in width and 65microns deep. Typical dimensions for a cleaning trench 982 can be, forexample, 2-12 inches (about 5.1-30.5 cm) long by 250 microns wide and250 microns deep. All dimensions given in this paragraph areapproximate.

The methods described above can be used in the fabrication and packagingof integrated circuit chips; in particular, techniques set forth hereincan be used to make arrays of solder balls for attachment to anintegrated circuit chip. The chip design can be created, for example, ina graphical computer programming language, and stored in a computerstorage medium (such as a disk, tape, physical hard drive, or virtualhard drive such as in a storage access network). If the designer doesnot fabricate chips or the photolithographic masks used to fabricatechips, the designer may transmit the resulting design by physical means(e.g., by providing a copy of the storage medium storing the design) orelectronically (e.g., through the Internet) to such entities, directlyor indirectly. The stored design can then be converted into anappropriate format such as, for example, Graphic Design System II(GDSII), for the fabrication of photolithographic masks, which typicallyinclude multiple copies of the chip design in question that are to beformed on a wafer. The photolithographic masks can be utilized to defineareas of the wafer (and/or the layers thereon) to be etched or otherwiseprocessed.

Resulting integrated circuit chips can be distributed by the fabricatorin raw wafer form (that is, as a single wafer that has multipleunpackaged chips), as a bare die or in a packaged form. In the lattercase, the chip can be mounted in a single chip package (such as aplastic carrier, with leads that are affixed to a mother board or otherhigher level carrier) or in a multi-chip package (such as a ceramiccarrier that has either or both surface interconnections or buriedinterconnections). In any case, the chip may then be integrated withother chips, discrete circuit elements and/or other signal processingdevices as part of either (a) an intermediate product, such as a motherboard, or (b) an end product. The end product can be any product thatincludes integrated circuit chips, ranging from toys and other low-endor consumer electronic applications to advanced computer products,having a display, a keyboard or other input device, and a centralprocessor. The techniques set for the herein can be used forinterconnecting the chip on chips or chip stacks for 3D applications,chips on wafers, chips on package or package on package.

It will be appreciated and should be understood that the exemplaryembodiments of the invention described above can be implemented in anumber of different fashions. Given the teachings of the inventionprovided herein, one of ordinary skill in the related art will be ableto contemplate other implementations of the invention.

Although illustrative embodiments of the present invention have beendescribed herein with reference to the accompanying drawings, it is tobe understood that the invention is not limited to those preciseembodiments, and that various other changes and modifications may bemade by one skilled in the art without departing from the scope orspirit of the invention.

1. A method comprising the steps of: providing a sheet of elastomericmaterial; cutting a first long incision along a surface of said materialto form a first straight wall making an angle, α, with horizontal, saidfirst long incision describing a line along said surface of said sheet;cutting a second long incision along said surface of said material toform a second straight wall making an angle, β, with horizontal, saidsecond long incision beginning at said line along said surface of saidsheet, such that a slot is formed, said slot having a relatively largecross-section end and a relatively small cross-section end opposed tosaid relatively large cross-section end, said relatively smallcross-section end being located at said line along said surface of saidsheet; and securing said sheet to a solder reservoir such that saidrelatively large cross-section end is in fluid communication therewith.2. The apparatus of claim 1, wherein α=β, such that said slot isV-shaped when viewed in cross-section along a length perpendicular to ascan direction.
 3. The apparatus of claim 2, wherein α and β each rangefrom about 30 degrees to about 70 degrees.
 4. The apparatus of claim 2,wherein α and β each range from about 45 degrees to about 60 degrees. 5.The apparatus of claim 1, wherein α is about 90 degrees and β rangesfrom about 30 degrees to about 70 degrees.
 6. The apparatus of claim 5,wherein β is about 45 degrees.
 7. The apparatus of claim 1, wherein saidrelatively small cross-section end of said slot, when locally open undersaid fluid pressure, has a width parallel to a scan direction of fromabout 2 microns to about 10 microns.
 8. The apparatus of claim 1,wherein said first and second straight walls have a length of from about1 inch to about 12 inches.